Cooling High Power Microchip Using Metallic Porous Heat Sink. Diyala Journal of Engineering Sciences , [S. l.], v. 18, n. 1, p. 103–119, 2025. DOI: 10.24237/djes.2025.18106. Disponível em: https://djes.info/index.php/djes/article/view/1529. Acesso em: 12 mar. 2025.