Rheological Behavior of Isothermal Cured Epoxy/1,4-Diaminobenzene Systems

Muataz H. Ismael; Salah N. Farhan; Ayad Dari Jaafar

doi:10.24237/djes.2018.11107

Authors

Muataz H. Ismael
Muataz.muataz@yahoo.com
Department of Chemical Engineering, University of Daiyla, Iraq
Salah N. Farhan Department of Chemical Engineering, University of Daiyla, Iraq
Ayad Dari Jaafar Department of Chemical Engineering, University of Technology, Iraq

Keywords:

Rheological, Curing agent system, Epoxy system, Curing temperature

Abstract

A novel curing agent (1,4-diaminobenzene) was used to enhance behavior of the epoxy resin system. The effect of the curing agent content (12 to 21 wt%) subjected to the isothermal curing temperatures at 80 °C to 110 °C were performed. Results indicate that the gel time was effected slightly on the viscosity when the curing temperature was higher than 90 °C and curing material consist over from 18wt %. These results explain that reaction rates caused by higher curing temperature.

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