Development of Sn-9Zn Solder Alloy by Adding Bismuth
Keywords:
melting point, lead-free solder, electrical resistivity, wettability, specific heat, heat of fusionAbstract
Tin-Zinc based on solder is a probable changing of lead element solder as a result of its enhanced mechanical characteristics. This alloy needs to be studied and explored to get a usable solder alloy having better properties. In this work Our objective of the accompanying investigation for alteration the warm, physical and bind qualities of eutectic tin-9Zinc fastening alloy by expansion various ratios of bismuth content to give elective without lead solder alloy to utilize this compound for efferent electronic ventures. We found that the addition of bismuth element content improved the thermal, physical and electrical features and qualities. We got the mentioned results by using x-ray diffractometer, differential scanning calorimetry and LCR instrument to calculate electric resistivity and the contact edge (CA) is the most important factor used for assessing the solid surfaces wettability. Sn91Zn3Bi6 alloy has best solder properties as low melting temperature, pasty range and contact angle. And has the beast soldering properties for electronic application compared to commercial Pb- Sn alloy
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